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Dicing Tape - List of Manufacturers, Suppliers, Companies and Products

Dicing Tape Product List

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Dicing tape

Uniform stretching and high expandability! We have prepared tape for UV-type dicing processes!

D&X Corporation handles "Dicing Tape." We offer UV-type dicing process tape that allows for tape release during die bonding, enhancing pick-up performance due to the reduction of adhesive strength caused by ultraviolet exposure. We also accommodate specification changes and the development of new types according to your requests. We can handle small-scale prototypes, so please inquire for more information. 【Features】 ■ Uniform elongation and high expandability ■ Reduced chipping ■ Strong adhesive strength ■ Suppression of whisker generation ■ High heat resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Company:D&X
  • Price:Other
  • Non-ferrous metals
  • Wafer processing/polishing equipment
  • others

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Dicing tape "RMGU"

Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.

1. Excellent scalability. 2. Low wafer contamination.

  • Wafer
  • Other polymer materials
  • Adhesive tape

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