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Dicing Tape Product List

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Exhibition January 2026: List of Exhibited Products for the 40th Nepcon Japan

Exhibition January 2026: List of Exhibited Products for the 40th Nepcon Japan

We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).

【40th Nepcon Japan January 21-23 (Tokyo Big Sight) featuring the following products】 1. Bonito (Dicing Tape) 2. Wave Clear (Back Grind Tape) 214D 3. Heat Resistant Molecular Gradient Film (200Y), Heat Resistant Adhesive Film (SB Sheet) 4. Heat Dissipation Gel Sheet 5. Chemical Resistant Dicing Tape 6. Metapian LCP/Metapian 7. Cleaning Tape 900 Series

  • Engineering Plastics
  • Other polymer materials
  • plastic
  • Dicing Tape

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Dicing tape

Dicing tape

Uniform stretching and high expandability! We have prepared tape for UV-type dicing processes!

D&X Corporation handles "Dicing Tape." We offer UV-type dicing process tape that allows for tape release during die bonding, enhancing pick-up performance due to the reduction of adhesive strength caused by ultraviolet exposure. We also accommodate specification changes and the development of new types according to your requests. We can handle small-scale prototypes, so please inquire for more information. 【Features】 ■ Uniform elongation and high expandability ■ Reduced chipping ■ Strong adhesive strength ■ Suppression of whisker generation ■ High heat resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Company：D&X
  • Price：Other
  • Non-ferrous metals
  • Wafer processing/polishing equipment
  • others
  • Dicing Tape

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D&X Corporation Company Overview

D&X Corporation Company Overview

With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!

D&X Corporation was founded on April 8, 2008, with its headquarters in Tokyo, and has branches in Shanghai, Taiwan, and Germany. Our business activities include research and development, production, and sales of semiconductor Si wafers and semiconductor tapes. We also provide processing services such as film deposition on semiconductor Si wafers, dicing, and back grinding. 【Business Activities】 ■ Sales of semiconductor consumables *For more details, please refer to the PDF document or feel free to contact us.*

  • Company：D&X
  • Price：Other
  • Wafer
  • Other semiconductors
  • Dicing Tape

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Dicing tape "RMGU"

Dicing tape "RMGU"

Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.

1. Excellent scalability. 2. Low wafer contamination.

  • Wafer
  • Other polymer materials
  • Adhesive tape
  • Dicing Tape

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[Market Report] Dicing Tape Market

[Market Report] Dicing Tape Market

Dicing tape market, 2022-2031: from 1.3902 billion to 2.3487 billion USD.

The global dicing tape market is expected to expand rapidly during the forecast period from 2023 to 2031, growing at a compound annual growth rate (CAGR) of 6%, with the market size increasing from 1.3902 billion USD to 2.3487 billion USD. The growth of the dicing tape market is supported by factors such as the expansion of the semiconductor industry, increased demand due to technological advancements, and the efficiency of manufacturing processes. In particular, as the automation and efficiency of the dicing process progress, the demand for dicing tape is rising increasingly. You can check the application method by clicking the [PDF Download] button or apply directly through the related links.

  • others
  • Dicing Tape

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